Category Archives: Dicing Materials
Challenges on dicing extra thick materials
The technology trend is everything getting smaller, however certain applications require dice extraordinarily thick materials, such as glass, quarts, ceramics, and some silicon. These applications range from making imprint masks, to making heat shields, and substrates that require an unusual … Continue reading
Mounting wafer on dicing tape
We have covered a number of aspects of the dicing process but still there are important areas that need to be discussed. I have written about what tapes are available and what are the parameters that define the tackiness, thickness, … Continue reading
Dicing Tapes
Selecting the right dicing tape is crucial for the dicing process. The right or wrong decision can make or brake a project. As you may be aware there are so many different choices, there is bound to be a tape … Continue reading
Barium Titanate
We recently did some test cuts on Barium Titanate to determine the best abrasive size for that particular material. We tried different size diamond and found out that this material is much like a ceramic in that it cuts better … Continue reading