Category Archives: dicing process
Challenges on dicing extra thick materials
The technology trend is everything getting smaller, however certain applications require dice extraordinarily thick materials, such as glass, quarts, ceramics, and some silicon. These applications range from making imprint masks, to making heat shields, and substrates that require an unusual … Continue reading
K&S Dicing Saw
Background about K&S Dicing Saw Established in 1950’s by Fred Kulicke and Albert Soffa, The K & S Company started working by designing automated solutions to various demands from all aspects of industry such as stuffing sausages and cleaning beer … Continue reading
Mounting wafer on dicing tape
We have covered a number of aspects of the dicing process but still there are important areas that need to be discussed. I have written about what tapes are available and what are the parameters that define the tackiness, thickness, … Continue reading
The integrated circuit and the dicing process
The making of the integrated circuit is a long and arduous process that involves various steps and procedures. In most cases the wafer, as its called, travels to different locations before it is completed and turned into the final product. … Continue reading