Background about K&S Dicing Saw
Established in 1950’s by Fred Kulicke and Albert Soffa, The K & S Company started working by designing automated solutions to various demands from all aspects of industry such as stuffing sausages and cleaning beer cases. From there, it rapidly developed a good reputation for innovation and reliability – the company offered their most important contributions to the semiconductor industry. They took advantage of the first semiconductor chip development by offering excellent solutions in this area. Later they expanded their contribution by designing semi-automated equipment for wafer fabrication and preparation as well as wafer dicing machines and tools.
Why choose the dicing blades equipment from K&S?
There are compelling reasons why choose the dicing blades equipment from K&S. In addition to the quality of machines and dicing blades they produce, the company has also contributed tremendously in techniques and theory. For instance, the writings of Gideon Levinson like “Dicing through hard and brittle materials in the micro electronic industry” and “Principles of Dicing” have, at the very least, influenced many engineers and operators like in Dicing Blades Technology. Indeed, their major contribution particularly in dicing has been their equipment.
The K&S dicing saw machine
In Dicing Blades Technology we regularly use the K&S 7100 dicing saw as shown in this photo.
This machine is capable of processing up to 6” wafers. It uses 2” blades and is capable of spinning them at up to 60K RPM. This tool is utilized for cutting all types of materials from silicon to quartz. This K&S dicing saw machine is versatile and is equipped to do contact and/or optical height sensing. Aside from that, it features pattern recognition and can be programmed to cut all kinds of dicing schemes. Truly, this machine and others of its caliber are the company’s legacy for this industry particularly for our dicing needs.